Google just placed an order for Intel to package over 3 million TPUs in 2028. TSMC's CoWoS packaging is completely maxed

BHK Cloud Engineering · · 1 min read

Google just placed an order for Intel to package over 3 million TPUs in 2028.

TSMC's CoWoS packaging is completely maxed out - Intel's EMIB is the only alternative that can qualify at volume before 2030.

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