AI capacity constraints are not just about GPU chips.
WCCFTech reports that TSMC may expand CoWoS packaging capacity from 130,000 wafers per month by the end of 2026 to 260,000 by the end of 2028.
This advanced packaging connects high-bandwidth memory and logic in AI GPUs.
It is a reminder that dependable compute and the storage around it matter at every layer.
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Originally posted on linkedin_personal